Liquid Cooling Module

Pipelines can be designed according to different product types, thus providing different thermal resolution efficiencies to solve the heat dissipation problem, which can well solve the problem of difficult heat dissipation of traditional power electronic products with high power. In the application of data center, the PUE value can be greatly reduced and energy consumption can be reduced.

Anti Corrosion
LDFC Technology
Excellent Sealing
Low Thermal Resistance
LIQUID COOLING MODULE
  • Working Temperature Range -30°C~90°C
  • Heat Homogeneity <5°C
  • Working Pressure 3 MPa
  • Heat Dissipation Capacity 200W/C ㎡
  • Liquid medium Deionized water, cooled water

How can we help?

Interested in this product? For further information and a spec sheet
please fill in our contact form and one of our specialists will contact you.